JET-6500 3d psi

SPI (Solder Paste Inspection) JET-6500 system provides an ideal solution to the inspection of solder paste by balancing capability and cost effectiveness. The latest dual projection design enables theJET-6500 to effectively eliminate the risk of shadowing and the problems with specular reflection. With the highly accurate linear motor and the high-resolution 3D camera, solder paste volume and height can be easily checked.

The easy programming, friendly user interface and automatic compensation for board warp, make the operation more convenient and help to improve manufacturing yield.

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